About us:
Equipment supplier to the whole of Europe for:
Wafer Manufacturing
We have equipment and experience in:
- Multi wire sawing:
- Sapphire
- Silicon Carbide
- GaAs
- CdTe
- InP
- Silicon
- Metals
- Ceramic Materials
- Cermets
- Glass Substrates
- Polishing
- Thickness and shape measurement
- Wafer sorting by thickness, type, shape, customer-specified criteria
Optical Substrates
- Slicing / Wafering
Semiconductor Back End processing
- Tape/Detape for Back Grinding area
- Wafer thickness and shape measure after grind
- Frame mount
MEMs/Sensor applications
- Resist lamination, tenting and conformal
